Hackaday5y
Lead-Free Solder Alloys: Their Properties And Best Types For Daily Use
Especially with large pin count BGA chips, a drop impact can cause ... Electromigration failure of interconnected solder joints. Finally, electromigration is the most insidious of all, as it ...
Design-Reuse7d
High Density FPGA Package BIST Technique
The solder bumps can be 0.6mm in diameter and placed on 1mm center to center. 2. Points of Failure: BGA Solder Joints The following is a list of some points of failure associated with FPGAs in BGA ...
搜狐1mon
Common Solder Defects and Root Cause Analysis
At reflow, the aggregate melts and emerges from the underside of the component, separate from the solder mass/joint. Fig ... occurs in components such as BGA, SGA, QFN, and LGA and increase ...
Hackaday3y
So You Can Solder Small SMD Devices. The Question Is, Just How Small?
his uSMD is a 555 LED flasher that uses a BGA 555 and a selection of 008004 small components. The trick with an 01005 is to heat not the tinned and fluxed solder joint, but the trace leading up to it.