Especially with large pin count BGA chips, a drop impact can cause ... Electromigration failure of interconnected solder joints. Finally, electromigration is the most insidious of all, as it ...

Figure 2: Top-down View of Solder Bump Mapping. The solder bumps can be 0.6mm in diameter and placed on 1mm center to center. 2. Points of Failure: BGA Solder Joints The following is a list of some ...

However, for many people, ball grid array (BGA) is still intimidating ... A gentle push from a hot air gun will push the solder balls over the melting edge. Even taking the part off the hotplate ...

At reflow, the aggregate melts and emerges from the underside of the component, separate from the solder mass/joint. Fig ... occurs in components such as BGA, SGA, QFN, and LGA and increase ...