近日，光电共封装CPO板块（Chip Package On）在资本市场上的表现引发了投资者的广泛关注。根据证券之星的报告，3月14日，光电共封装CPO板块整体上涨2.71%，其中中天科技更是以突出表现领涨板块，吸引了大量主力资金的追捧。与此同时，上证指数和深证成指也有着良好的表现，分别上涨了1.81%和2.26%。

As such, the result is a chip that’s flat to the PCB like an SMD component, but with leads that extend much farther out than any traditional package. Obviously, the body of a DIP chip is still ...

2025年3月6日，CPO（Chip on Package）概念股经历了一波明显的上涨，市场记录显示该概念整体上涨了2.15%，主力资金的流入量高达12.5亿元。在激烈的资金博弈中，众多个股齐头并进，中贝通信和紫光股份的表现尤为突出，吸引了众多投资者的目光。 在CPO概念股中，中贝通信以4.72亿元的资金净流入名列第一，股票价格上涨了10.04%，达到29.26元。这一表现无疑显示出市场对其未来成 ...

The amount of data that needs to move around a chip is growing exponentially, driven by the rollout of AI and more sensors ...

Together, we are pioneering the next generation of smart, safe, and durable chip packages. Our mission is to provide access to cutting-edge innovation, infrastructure, and education, with the goal of ...

HONG KONG--China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self-sufficiency in chips and ...

Qualcomm is reportedly developing its next-generation high-end processor for Windows PCs, the Snapdragon X2. The new chip is expected to feature a significant increase in core count, boasting up to 18 ...

The A18 chip (6-core CPU + 4-core GPU) utilizes TSMC’s N3E process and InFO-PoP (Integrated Fan-Out Package on Package) packaging technology, with its advanced neural network engine (NPU) powering ...