Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...

Power Integrations reported a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up ...

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its VSOP383xx series of preamplifier circuits for infrared (IR) remote control applications in consumer products with the ...

Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, ...

Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade ...

By employing the established DMP design and PIN layout of the previous ICs, the MLX90425 offers the company's latest magnetic position sensing technology in a legacy package. This provides the ...

Fig.2. Failure analysis methodologies used in IC development (a) (b) [1] JCH Phang, DSH Chan, M. Palaniappan, JM Chin, B. Davis, M Bruce, “A review of Laser Induced Techniques for Microelectronic ...