来自MSN3 个月
Preparation of Low-Melting Solder Materials for Atom Probe Tomography
This study focused on optimizing Ga-FIB preparation of APT specimens for low-melting SAC305 solder materials. The SAC305 solder alloy specimen was reflowed at 240 °C, then cooled rapidly to 90 ...
Circuits Assembly Online Magazine10 天
Indium Corporation to Showcase High-Reliability Solder Technology at IPC Apex
Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, ...