The two most commonly used types of lead-free solder are SnAgCu (tin-silver-copper, also called SAC) and SnCu (tin-copper). SnAgCu alloy with 3% silver and 0.5% copper (SAC305) was initially ...

This study focused on optimizing Ga-FIB preparation of APT specimens for low-melting SAC305 solder materials. The SAC305 solder alloy specimen was reflowed at 240 °C, then cooled rapidly to 90 ...

Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, ...