A SOCAMM measures 14x90mm — one-third of a traditional RDIMM — and carries up to four 16-die LPDDR5X memory stacks. Micron's ...

This new modular memory form factor is designed to unlock the full potential of AI platforms and has been developed ...

Explore Micron's growth in HBM memory driven by AI demand, DRAM price cycles, and market dynamics in this deeply cyclical ...

While data center GPUs are transitioning to HBM3e, the memory roadmaps revealed at Nvidia GTC make it clear that HBM4 will be ...

Emotions ran high among those who opposed the newly proposed site for SK Hynix in West Lafayette, as several experts weighed ...

At the ongoing Nvidia GTC 2025, both SK Hynix and Micron Technology have demonstrated their respective AI memory solutions.

SK hynix Inc. (or "the company", announced today that it will participate in the GTC 2025, a global AI conference taking ...

"We plan to start mass production in the second half of 2028," as the company had previously announced, a spokesman said in ...

SK hynix said on Wednesday it has shipped samples of the next-generation high bandwidth memory (HBM), 12-layer HBM4, to its ...

The company is also showcasing a prototype of the next-generation 12-layer HBM4, which is still under development, for the ...

South Korean memory chip giant SK Hynix Inc. has begun delivering samples of the world’s most advanced, next-generation high ...

SOCAMM(Small Outline Compression Attached Memory ... will also be displayed. *** Full Stack AI Memory Provider: SK hynix's vision to be a provider of a full-range of AI memory products and ...