To demonstrate creep behavior at room temperature, we can use 60/40 solder that contains 60 wt% Sn (tin) and 40 wt% Pb (lead). The phase diagram for the Pb-Sn alloy system is shown below, and the ...
The braid wicks the bismuth-tin mix away from the leads along one side of the chip, while gravity pulls it down the braid to pool safely on the bench. Pretty slick. Lest leaded solder fans fret ...
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