Back when AMD's Ryzen 7000 processors first came out, enthusiasts theorized that the extra-thick heatspreader used on Socket ...
Verifying the functionality of a full multi-chip system, including digital controllers, analog electrical, and photonic ...
Many of will have marveled at the feats of reverse engineering achieved by decapping integrated circuits and decoding their secrets by examining the raw silicon die. Few of us will have a go for ...
The Alphawave Semi UCIe PHY IP is an extremely power efficient, low-latency, and highly reliable interface IP, designed to connect chiplet silicon die in the same package at top speeds of 24Gbps per ...
Naturally, it’s far easier and cheaper if a GaAs laser can be grown directly on the silicon die, which is what researchers from IMEC now have done (preprint). Using standard processes and ...
A moment or two with a delidding tool revealed a big surprise. Where the silicon die usually resides, affixed to the green substrate under the prized-off IHS, there was a vacant space. This isn't ...
The silicon IP includes high-speed 3D I/O for vertically stacking die inside chiplets. Given a projected 45% TAM growth annually, custom silicon is expected to account for approximately 25% of the ...
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