OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of ...

However, using 2D semiconductors in large-scale integrated circuits requires precise control ... using Nb-doped or Re-doped 2H-MoTe 2 thin films (~5 nm). The channels were defined through ...

have collaboratively found a new approach to building nuclear clocks using thorium thin films. The technological leap is equivalent to the use of semiconductors and integrated circuits in ...

Quantum Computing (QUBT) has received a fifth purchase order for its thin film lithium niobate – TFLN – photonic chip foundry. The latest ...

Quantum Computing Inc. ("QCi" or the "Company") (Nasdaq: QUBT), an innovative, integrated photonics and quantum optics technology company, today announced it has received a fifth purchase order for ...

Thin-film lithium niobate (TFLN) technology has enabled tight mode confinement and ... Various compact integrated photonics devices have been realized on the TFLN platform, such as compact high ...