Many different circuits on the same die, tied together with three-dimensional interconnects. Image source: Pavlidis & Friedman, Three-dimensional Integrated Circuit Design (2010) In the late 1960s ...

Three-dimensional integrated circuit (3D IC) technology represents a significant advancement in semiconductor design, allowing for the vertical stacking of multiple layers of integrated circuits.

Thermal management in three-dimensional integrated circuits (3D ICs) is a critical area of research due to the increasing complexity and density of modern electronic devices. As more components ...

"We report an intrinsically permeable, three-dimensional integrated electronic skin." Instead of utilizing impermeable and rigid printed circuit bords, Zhuang, Yao and their colleagues used a skin ...

Friedman. As part of his doctoral work, he developed circuit design techniques and methodologies for proper synchronization and power delivery of heterogeneous three-dimensional integrated circuits.