DS Smith is helping Niels & Grete replace its plastic packaging components with a corrugated cardboard pack, boosting ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical ... A new user interface supports a cross-hierarchical, 3D-aware design methodology that ...

promote and otherwise make the product marketable and keep it clean Packaging is more than just your product's pretty face. Your package design may affect everything from breakage rates in ...