Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...
Xpedition™ Package Designer (xPD) 软件专为新兴高密度先进封装 (HDAP ... 准确识别 EM 电流密度违规情况,以及为 3D-IC 封装设计提供准确的提取和建模。 将 2.5D 3D IC 物理验证提升到更高水平 随着封装设计的发展,验证要求和挑战如影相随。设计人员在处理 2.5/3D IC 设计 ...
3D-IC(三维集成电路)技术作为芯片行业的一项突破性创新,近年来在数据中心和神经处理等领域展现了显著的进步。 通过将多个芯片垂直堆叠并 ...
AI can help with workload distributions when considering on-device versus cloud processing. The latter has a very large ...
Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade ...
will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve this milestone in collaboration with our 3D integration partners including ...
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