Semiconductor Engineering3 天
3D-IC For The Masses
Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...
电子工程专辑11 个月
3D IC 设计解决方案
Xpedition™ Package Designer (xPD) 软件专为新兴高密度先进封装 (HDAP ... 准确识别 EM 电流密度违规情况，以及为 3D-IC 封装设计提供准确的提取和建模。 将 2.5D 3D IC 物理验证提升到更高水平 随着封装设计的发展，验证要求和挑战如影相随。设计人员在处理 2.5/3D IC 设计 ...
OFweek维科网2 天
面向高性能的3D-IC芯片堆叠技术，如何普及？——技术现状、挑战与 ...
3D-IC（三维集成电路）技术作为芯片行业的一项突破性创新，近年来在数据中心和神经处理等领域展现了显著的进步。 通过将多个芯片垂直堆叠并 ...
Semiconductor Engineering3 天
Fulfilling 3D-IC Trade-Off Analyses (And Benefits) With An AI Assist
AI can help with workload distributions when considering on-device versus cloud processing. The latter has a very large ...
新浪网6 天
3D IC概述
3D IC（三维集成电路）是一种通过垂直堆叠多个芯片层实现更高集成度的半导体技术。与传统二维平面芯片不同，它突破了平面布局的物理限制 ...
Electronic Design10 天
Switcher IC Targets 800-V Automotive Apps with Advanced Wide-Creepage Package
Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade ...
Design-Reuse3 年
IMEC sets major step towards 3D integration of DRAM on logic
will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve this milestone in collaboration with our 3D integration partners including ...