GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

From Co-Design to Manufacturing: For Die, Chiplet and 3D IC Package Wednesday, Feb 5, 2025 I agree to receive commercial messages from GlobalSpec including product announcements and event invitations, ...

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

Circuits Integrated Hellas (CIH), a pioneering innovator in advanced satellite communication (SatCom) technology, has been selected as a laureate startup to compete in the Innovation Challenge at ...

The collaboration between MediaTek and embedded software firm Exein aims to make security an integral part of the development Continue Reading ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Python module for the PCA9685 PWM controller, which is part of the SparkFun Servo pHAT for Raspberry Pi and SparkFun Pi Servo HAT This package should be used in conjunction with the overall SparkFun ...

The slowdown of Moore’s Law is also pushing semiconductor design in new directions including 3D, chiplets and complex hybrid packages. It’s not just a design challenge; it triggers major changes in ...

While his main areas of expertise are maker tools -- 3D printers, vinyl cutters, paper printers, and laser cutters -- he also loves to play board games and tabletop RPGs. Expertise 3D printers ...

Electron micrograph of a wire bond to the Z80 CTC die Integrated Circuit Engineering Corporation ... starts with an examination of the package, in this case the more expensive ceramic variant ...