Abstract: A simulation analysis was conducted to investigate the stress distribution of Package-on-Package (PoP) assembly array solder joints subjected to thermal-torsional coupling loads, with the ...

President Trump will head to the Capitol on Tuesday for the first joint address of his second term emboldened by a month of mass federal agency slashing, shocking foreign policy moves and a ...

This study investigates the reliability of solder joints in Ball Grid Array (BGA) packages by examining their dynamic response under board-level drop impacts using Finite Element methods. Explicit ...