Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

Especially with large pin count BGA chips, a drop impact can cause ... Electromigration failure of interconnected solder joints. Finally, electromigration is the most insidious of all, as it ...

At reflow, the aggregate melts and emerges from the underside of the component, separate from the solder mass/joint. Fig ... occurs in components such as BGA, SGA, QFN, and LGA and increase ...

Figure 2: Top-down View of Solder Bump Mapping. The solder bumps can be 0.6mm in diameter and placed on 1mm center to center. 2. Points of Failure: BGA Solder Joints The following is a list of some ...