20.1.1). Traditional gas sensors typically have the transducer and CMOS chip connected via wiring on a substrate, leading to a large-form factor that requires complicated and expensive packaging and ...

HRL Laboratories plans to surpass heat transfer metrics set out by the Defense Advanced Research Project Agency (DARPA) with ...

The ongoing demand for high-capacity on-die SRAM necessitates optimal-density scaling as we transition technology ... Design-technology co-optimization (DTCO) becomes essential to achieving further ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling ...

Figure 1 below shows an overview of the Tellum II, including a die photo and labeled blocks of the processor. There are 8 cores on the chip, 3 on the left and 5 on the right. The left side also ...

Read Less Chip is a digital savings and investment app, founded in 2017 with the help of crowdfunding. It is not a bank but it is fully regulated by the Financial Conduct Authority (FCA ...

between the silicon die and the packaging substrate during various processing steps, increasing the risk of the BEOL failure. To preserve the mechanical integrity of the BEOL, it is crucial to offset ...