Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration ...

Written by Lyn R. Zbinden, a mechanical engineer and glass specialist, this book narrows the gap between the reader and a technical subject by using language that is easy to understand, a good variety ...