当前，3D NAND技术正在迅速发展，多家厂商正在加速推进300层以上的堆叠 ... 因为它们将直接关系到CE标志的认证。 由于供应过剩，SK Hynix计划在上半年将其NAND闪存产量减少10%，NAND闪存价格已经连续四个月下跌，SK Hynix的减产举措反映了对当前市场环境的应对 ...

South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues to ...

我们预计 Solidigm 将宣布新一代 3D NAND 技术，使其更接近或甚至进入 300 多层领域。Solidigm 的所有者 SK hynix 已经达到了 321 层。 注释： Toggle 模式 NAND ...

Samsung has signed an agreement with China’s YMTC to use its bonding technology in the production of 400-layer NAND flash ...

In addition, Micron and its 3D NAND partner, Intel, have recently begun sampling 3D NAND chips, with production slated for the second half of 2015. Another 3D NAND vendor, SK Hynix, plans to move into ...

几个月前，SK hynix展示了新一代的Platinum P51 Gen5固态硬盘，这是一款基于238层3D TCL NAND闪存设计的高端消费存储产品。在 Computex 上，SK hynix 似乎悄悄地 ...

“The acquisition of Intel’s 3D NAND Flash capacity will massively elevate SK Hynix’s competitiveness in the enterprise SSD market,” the firm said. “Going forward, it remains to be seen ...

Robert Crooke, senior vice president and general manager of Intel’s NAND Products and Solutions Group, says he will become CEO of the U.S.-based company once SK Hynix’s $9 billion acquisition ...

South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400 ...

Advancements in 3D NAND have pushed chip designs beyond 200 layers, with companies like Micron, SK Hynix, and Samsung already eyeing 400-layer technology to increase storage density. However ...