DuPont de Nemours, Inc. DD has unveiled a comprehensive portfolio of cutting-edge circuit materials and solutions at the 2025 ...

Power device makers roll out their latest advances at APEC 2025, targeting a range of applications from AI data centers to ...

Active interposers with transistors will gradually replace passive interposers, driving the transition to vertical stacking.

Malaysia’s semiconductor sector sees a boost with ARM’s US$250M investment, aiming for high-value chip design and advanced ...

This January 16 interim final rule by the US Department of Commerce’s Bureau of Industry and Security (BIS) imposes a broader license requirement ...

TI unveils the first 48-V integrated hot-swap eFuse and a new family of integrated GaN power stages in TOLL packaging.

Demand for advanced semiconductor foundry capacity will remain at an all-time high in 2025. Many leading industry analyst ...

Navitas Semiconductor has announced what it believes are the world’s first production-released 650 V bi-directional GaNFast ...

Toshiba Electronics Europe GmbH has begun mass production of the AEC-Q100 qualified TB9103FTG MOSFET gate driver IC, featured in Toshiba’s recent motor control reference design for driving automotive ...

Onsemi has introduced the first generation of its 1200V SiC MOSFET based SPM 31 intelligent power modules (IPMs).

Hana RFID, Goodyear and Michelin have been working together on a variety of UHF RFID tire tags that identify tires on ...

With their low current consumption over a wider voltage range in a compact package, the Vishay Semiconductors VSOP383xx ...