Fluorescence images of calcium ions confined in the BGA trap. Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing ...
With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).
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