IC Insights believes it would be a win-win for both companies. February 12, 2014 -- Intel, the world’s largest semiconductor company, has come under attack and is backed into a corner. With shipments ...

Intel has put back its $100 billion Ohio chip project until 2030 or 2031. The first fab in the multi-fab project will not be completed until 2030. It had been due to start this year. The completion of ...

He was responsible for driving Intel's push into the contract semiconductor manufacturing space. As it stands, contractors working on Intel's Ohio fab site recently completed the basement level of ...

TL;DR: Intel announced Lip-Bu Tan as CEO and achieved a milestone by testing its 18A process node wafers at its Arizona fab, marking a significant step for U.S. semiconductor manufacturing.

Notable announcements include a multi-billion-dollar partnership with Amazon Web Services (AWS) and the decision to put fab and packaging ... to use custom Intel Xeon processors One significant ...

but eventually the fab will start running actual chips for commercial products. Intel is set to mass produce compute chiplets for its upcoming codenamed Panther Lake processors on 18A technology ...

While the CEO appointment drew the most attention, Intel's quiet confirmation that 18A wafers had already been processed in its Arizona fab is arguably ... generation mobile processor will be ...

Meanwhile, an engineering manager at Intel posted some celebratory images from the company's Arizona fab marking an "Eagle has landed" moment for the crucial 18A node, an indication the new node ...