思路很类似 AMD 今天的 CPU，但 AMD 利用的是基板的 IF 总线传递，延迟会更大一点。 而 intel 在多 Tile 之间连接方式是在下面再加上一片 Base Tile 用来 ...

Intel will use its Foveros 3D packaging technology to stack the tiles vertically for upcoming processors. One upcoming Intel product that will rely on internal and external manufacturing processes ...

The TILE-Gx9 processor, with advanced 64-bit cores, delivers the compute needed for highly integrated products, offering richer services and applications in a standard Linux environment SAN JOSE, ...

Intel plans to start its Panther Lake mobile processors production in September using its 18A node, with availability in Q1 ...

Arrow Lake-St（即英特尔酷睿Ultra第2代台式机处理器）可看成Lunar Lake （即英特尔酷睿Ultra第2代笔记本处理器)的完整版，同样采用先进的台积电3nm制造工艺。 核心层面，整体采用多Tile设计，分为Compute ...

Intel helps customers accelerate workloads with seamless integration and the highest bandwidth processor interfaces. May 23, 2023 -- Intel’s Programmable Solutions Group today announced that the Intel ...

The third node is Intel 3, which will power processors entering production in ... die disaggregation and “mixing multiple top die tiles with multiple base tiles across mixed fab nodes.” ...