There is a good reason why tin (Sn) is so commonly used in soft solder and solder alloys: it melts at low temperatures (232°C) and offers good wetting (ability to flow on the pad) properties in ...

[Martin Thuo] at Iowa University used this property to make solder joints at room temperature using Field’s metal (a combination of bismuth, indium, and tin). The key is a process that coats the ...