This study focused on optimizing Ga-FIB preparation of APT specimens for low-melting SAC305 solder materials. The SAC305 solder alloy specimen was reflowed at 240 °C, then cooled rapidly to 90 ...

This solder paste incorporates the newly designed high- reliability lead-free alloy PF918, which boasts a tensile strength performance 1.4 times greater than the typical SAC305 alloy. Moreover ...

Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, ...