Tech billionaire and anti-aging influencer Bryan Johnson responded plainly that he does not believe he is going to die, thanks to his lifestyle. Johnson appeared on The Free Press’ "Honestly ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

So, in forthcoming generations of integrated consumer electronic devices, chips are increasingly likely to be constructed from more than one die within a single package. There are two important ...

Wolfspeed introduced its Gen 4 SiC MOSFET platform, supporting long-term roadmaps for high-power, application-optimized ...

Democracy will die “at the hands of Silicon Valley” if artificial intelligence is not properly regulated, a peer has warned ...

3D packaging, in particular, is gaining traction in applications like high-performance computing (HPC), AI accelerators, and data centers. Fan-Out Wafer-Level Packaging (FOWLP) FOWLP extends the ...

The lack of highly scalable, native CMOS-integrated light sources has been a major roadblock for the widespread adoption of silicon photonics. Hybrid or heterogeneous integration solutions, such as ...

Baya Systems, a chip technology company that wants accelerate intelligent computing, raised $36 million in funding.

When accounting startup Bench abruptly failed last month, the shutdown was forced when the company's lenders called in the ...

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

Industry leaders join team of experts including Jim Keller, Sailesh Kumar and Stan Reiss to propel innovation in the new era of high-performance system-of-chiplets design ...