As great as silicon is for semiconductor applications, it has one weakness in that using it for lasers isn’t very practical. Never say never though, as it turns out that you can now grow ...

IP can be packaged in different ways, including soft IP (software), hard IP (physical layout), and even as “chiplets,” individual silicon die that deliver the IP function. The revenue, according to ...

One of the core innovations is that Broadcom uses face-to-face 3D chip-stacking technology based on hybrid bonding, which connects the pillars of copper wiring on the front of each silicon die ...