Many different circuits on the same die, tied together with three-dimensional interconnects. Image source: Pavlidis & Friedman, Three-dimensional Integrated Circuit Design (2010) In the late 1960s ...

Three-dimensional integrated circuit (3D IC) technology represents a significant advancement in semiconductor design, allowing for the vertical stacking of multiple layers of integrated circuits.

Thermal management in three-dimensional integrated circuits (3D ICs) is a critical area of research due to the increasing complexity and density of modern electronic devices. As more components ...

Orlowski, Lingjia Liu, Yang Yi, “Robust Deep Reservoir Computing through Reliable Memristor with Improved Heat Dissipation Capability,” IEEE Transactions on Computing Aided Design of Integrated ...

Friedman. As part of his doctoral work, he developed circuit design techniques and methodologies for proper synchronization and power delivery of heterogeneous three-dimensional integrated circuits.