Three-dimensional integrated circuit (3D IC) technology represents a significant advancement in semiconductor design, allowing for the vertical stacking of multiple layers of integrated circuits.

Thermal management in three-dimensional integrated circuits (3D ICs) is a critical area of research due to the increasing complexity and density of modern electronic devices. As more components ...

Circuits Integrated Hellas (CIH), a pioneering innovator in advanced satellite communication (SatCom) technology, has been selected as a laureate startup to compete in the Innovation Challenge at ...

Abstract: Multiconductor or multiwire arrangements find many applications in electronic systems. Examples are interconnections between digital circuits or integrated microwave circuits. Equivalent ...

The New Mexico research and development lab will combine its own Nano Solutions On-Chip project (NSOC) with three others into ...

Taipei, Taiwan, Jan. 16, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design ...

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...

China Hunan Provincial Key Laboratory of Two-Dimensional Materials, College of Physics and Electronics, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha 410082, ...

Circuits Integrated Hellas (CIH), a pioneering innovator in advanced satellite communication (SatCom) technology, has been ...

Treasury’s final rule implementing its outbound investment regime went into effect on January 2, 2025. The final rule implemented Executive ...