And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?
Aehr is now the only company offering both wafer-level and package-level test and burn-in solutions for AI processors. Gayn Erickson, President and CEO of Aehr Test Systems remarked: "With this ...
(Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon ...