GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

From Co-Design to Manufacturing: For Die, Chiplet and 3D IC Package Wednesday, Feb 5, 2025 I agree to receive commercial messages from GlobalSpec including product announcements and event invitations, ...

More than 50 firefighters were involved in tackling a serious blaze at a business in Aberdeen. The fire broke out at Norscot Truck and Van at Woodside Road in the Bridge of Don area on Sunday evening.

Circuits Integrated Hellas (CIH), a pioneering innovator in advanced satellite communication (SatCom) technology, has been selected as a laureate startup to compete in the Innovation Challenge at ...

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

The collaboration between MediaTek and embedded software firm Exein aims to make security an integral part of the development Continue Reading ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Super Bowl shoppers facing high prices at the grocery store. As the players are scoring points on the field, consumers will ...

The slowdown of Moore’s Law is also pushing semiconductor design in new directions including 3D, chiplets and complex hybrid packages. It’s not just a design challenge; it triggers major changes in ...

Python module for the PCA9685 PWM controller, which is part of the SparkFun Servo pHAT for Raspberry Pi and SparkFun Pi Servo HAT This package should be used in conjunction with the overall SparkFun ...