Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

Especially with large pin count BGA chips, a drop impact can cause ... Electromigration failure of interconnected solder joints. Finally, electromigration is the most insidious of all, as it ...

Figure 2: Top-down View of Solder Bump Mapping. The solder bumps can be 0.6mm in diameter and placed on 1mm center to center. 2. Points of Failure: BGA Solder Joints The following is a list of some ...

At reflow, the aggregate melts and emerges from the underside of the component, separate from the solder mass/joint. Fig ... occurs in components such as BGA, SGA, QFN, and LGA and increase ...