Abstract: This article introduces a planar-packaged terahertz (THz) transmitter, codesigned with a highly integrated CMOS active chip and a folded reflectarray (FRA). This design addresses the ...

The extra layers are required for digital to obtain an optimum die area, whereas in many case for RF the use of the extra ... The other is the fully integrated CMOS approach, which permits single chip ...

Presentations at the ISSCC 2001 [1] and ISSCC 2002 [2], showed a number of solutions in BiCMOS, 0.35 mm CMOS and 0.25 mm CMOS. This paper describes the radio part of a Bluetooth single-chip ASIC in ...

New reports on U.S. IC chemicals and materials availability; China export blacklist expands; global fab equipment report; ...

The integration and miniaturization of amplifiers and oscillators, crucial for modern electronics, are achieved through ...

Fabricated in a standard 130nm CMOS process and operated at 1.2V supply for most circuits excluding PA, 3.3V supply for PA, the receiver and the transmitter consume 68.2mW and 164.3mW, including the ...

Upgrades to Keysight’s double-pulse test systems bring easier and even higher-accuracy measurement of dynamic characteristics ...

RF coupling is one of the most important and tricky issues that RFIC designers always must confront while developing wireless ...

The best tech products announced this week include Klipsch's reimagined Heritage loudspeakers, Pro-Ject's automatic turntable ...

In a significant advancement for semiconductor technology, ECE's Prof. Kaustav Banerjee , co-authors Arnab Pal & Wei Cao and researchers have unveiled novel three-dimensional (3D) transistors ...