In a significant advancement for semiconductor technology, ECE's Prof. Kaustav Banerjee , co-authors Arnab Pal & Wei Cao and researchers have unveiled novel three-dimensional (3D) transistors ...

RF coupling is one of the most important and tricky issues that RFIC designers always must confront while developing wireless ...

Researchers propose 3D semiconductor architectures using 2D semiconductor materials for better performance and scalability ...

An approach that improves energy efficiency and reduces power using three coupled control loops.

HRL Laboratories plans to surpass heat transfer metrics set out by the Defense Advanced Research Project Agency (DARPA) with ...

Power consumption has become a primary constraint in design, along with performance, clock frequency and die size. Lower power can be achieved only by designing ... Sources of Power Dissipation The ...

Trump’s remarks, he called the law a “horrible, horrible thing.” “You should get rid of the CHIP Act,” he told Speaker Mike Johnson as some lawmakers applauded. The CHIPS program was one ...

Apple is marching in with new products for the spring, including a new MacBook Air featuring the M4 chip, a new iPad Air, uniquely featuring the M3 chip, and a new Mac Studio desktop, with M4 Max ...

When does the golden rule of semiconductor scaling finally break? How small can a transistor be? And what in the world is "dark silicon?" Read on for an overview of Moore's Law.

Synopsys' Abhijeet Chakraborty’s Chiplet Summit keynote focused on multi-die designs. You can send press releases for new products for possible coverage on the website. I am also interested in ...

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