High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

SK Hynix has reportedly reached a significant milestone in its pre-production trials by raising the yield rate of its sixth-generation high-bandwidth memory (HBM4) to 70%. This achievement strengthens ...

SK Hynix is also said to be speeding up the development of HBM4 to meet NVIDIA’s growing demand and is aiming to ship HBM4 samples to NVIDIA as early as June 2025, with full-scale product supply ...

Han Kwon-hwan, vice president of SK hynix's HBM convergence technology, said on the 26th, "The 5th generation high bandwidth memory (HBM) product ‘HBM3E 12-layer,’ which will be primarily ...

The company plans to ramp up production of its 12-stack HBM3E memory and supply it to its ... At the same time, SK Hynix, another major player in the semiconductor market, is speeding up the ...

Samsung used Memcon 2024 to showcase its HBM3E 12H chip – the industry’s first ... Samsung has lagged behind archrival SK Hynix in the HBM chip segment, forcing it to invest heavily to boost ...

Samsung was expecting to have its HBM3E memory quality certification achieved by 2H 2024, but it missed that by a long shot and let fellow South Korean memory rival SK hynix, take most of NVIDIA's ...

Moreover, the organization instead will roll into the HBM3E 12H (12-layer ... from the competitors such as Micron company and SK Hynix. Micron being one of the leaders in production of HBM ...

The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October. Click to ...

SK Hynix said in a statement it was the world's first latest-generation HBM product, called HBM3E, with 12 layers and 50% bigger capacity than the previous eight-layer chips. SK Hynix, which has ...

which for SK hynix will likely include next-generation HBM4 products. The company plans to begin shipping its latest 16-layer HBM3E chips in the first half of 2025 and start mass production of ...