You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Jagbir Singh是Smith & Nephew公司负责机器人技术的电气工程师。 （原文刊登于EE Times姊妹网站EDN，参考链接：Thin PCBs: Challenges with BGA packages，由Franklin Zhao编译。） 来源于电子工程专辑，作者Jagbir Singh 半导体工程师半导体行业动态，半导体经验分享，半导体成果交流 ...

You can now upload your own images to use with our AI‑powered tools: Place an uploaded product shot into any scene you can imagine. Use your own photo or illustration as a reference image for image‑to ...

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After hours: February 7 at 6:31:19 PM EST Loading Chart for AMKR ...

Each robot is equipped with a Raspberry Pi 4 for processing image data and computing positions, and the two robots communicate via Bluetooth to coordinate their efforts. It’s an interesting ...

Abstract: This paper presents a D-band 16-element phased-array transceiver IC with integrated dual-polarized antenna for 6G wireless communications. Fabricated in 28-nm CMOS, the transceiver operates ...