YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Lakeville, Minnesota, February 4, 2025 – ITW EAE will be showcasing its latest developments at IPC APEX, March 18 - 20 in Anaheim. The ITW EAE booth #2400 will have MPM, Camalot, Electrovert, ...

Looking for a high-current solution with easy integration and noise suppression? Find out how this SMD choke series could improve your designs.

With stray inductance of up to 1% of the nominal inductance, these chokes also dampen differential-mode noise. All components meet IEC/EN 60938-2 standards and share a compact footprint of 40mm x 38mm ...

However, the increase in the activity may produce more flux residues, which can corrode the metal surface after soldering. The requirement for flip chip reflow soldering should be considered. After ...

Abstract: A finite element analysis model of a printed circuit board assembly (PCBA) was established. The model was subjected to a reflow soldering temperature profile to analyze the temperature ...

The 0402 and 0201 components are in a weird spot, where soldering iron assembly is no longer really viable, but the stencil+reflow approach might not be unilaterally successful when you start off ...

[Erich aka VK5HSE] performs quite a bit of solder reflow work, but has always been concerned about bumping his circuit boards once the solder has liquified and is ready to be removed from the heat ...