来自MSN5 个月
SK海力士领先全球量产12层堆叠HBM3HBM3E是HBM3的扩展版。 SK海力士指出,现有的HBM3E最大容量为24GB,由8颗3GB DRAM芯片垂直堆叠而成,公司将在2024年底前向客户提供相关产品,这是继2024 ...
Hsinchu, Taiwan – July 07, 2022 – Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix’s first available HBM3 ...
SK Hynix leads the HBM market and is the main supplier ... though Samsung's fourth-generation HBM - dubbed HBM3 - has been cleared by Nvidia for use in its less-sophisticated graphics processors ...
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