New technologies drive new terminology, but the early days for those new approaches can be very confusing.

Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...

and that some modern IC packages expose the underside of the silicon die directly to the outside world. Initial tests indicated that the angle of the incident IR light was important to visualizing ...

Marvell Technology has demonstrated its first 2-nm silicon IP, enhancing the performance and efficiency of AI and cloud infrastructure.

Naturally, it’s far easier and cheaper if a GaAs laser can be grown directly on the silicon die, which is what researchers from IMEC now have done (preprint). Using standard processes and ...

The SSD RDK incorporates Silicon Motion’s PCIe Dual Ported enterprise-grade SM8366 controller, which supports PCIe Gen5 x4 ...

over heterogeneous wafer- and die-bonding technologies and eventually direct epitaxial growth in the longer term," states Joris Van Campenhout, fellow silicon photonics and director of the ...

IP can be packaged in different ways, including soft IP (software), hard IP (physical layout), and even as “chiplets,” individual silicon die that deliver the IP function. The revenue, according to ...

The Marvell® 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era. Built on ...

All major foundries have adopted the programmable electrical rule checker (PERC) as the pre-silicon electrostatic discharge (ESD) signoff tool for IP and chip designs. This concept of rule checking ...