Three-dimensional integrated circuit (3D IC) technology represents a significant advancement in semiconductor design, allowing for the vertical stacking of multiple layers of integrated circuits.

Many different circuits on the same die, tied together with three-dimensional interconnects. Image source: Pavlidis & Friedman, Three-dimensional Integrated Circuit Design (2010) In the late 1960s ...

Taipei, Taiwan -- Jan 17, 2025-- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high ...

Friedman. As part of his doctoral work, he developed circuit design techniques and methodologies for proper synchronization and power delivery of heterogeneous three-dimensional integrated circuits.

Alchip Technologies, a developer of high-performance ASICs, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and ...

"We report an intrinsically permeable, three-dimensional integrated electronic skin." Instead of utilizing impermeable and rigid printed circuit bords, Zhuang, Yao and their colleagues used a skin ...