CP（Chip Probing，亦称WS(Wafer Sort) ）是芯片在wafer阶段，通过ATE+Prober+probe card对芯片进行功能和性能参数测试。考虑高效的测试模式如IP测试、DFT测试及功能覆盖性测试。 FT（Final Test）是芯片在封装完成以后进行的最终的功能和性能测试，是产品质量控制最后环节 ...

we were talking about trying to get that to zero as quickly as possible. That's no longer the strategy. We think it's always good to have at least some of our wafers with TSMC. They're a great ...