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Electronic Design
2 分钟
2024 PowerBest Winners: Power Devices
SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...
Electronic Design
2 分钟
2024 PowerBest Winners: Passives, Packaging, and Applications
Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...
Electronic Design
3 小时
Readers’ Choice: The Best Analog Articles of 2024
Electronic Design’s readers have spoken. We present the top analog articles of 2024, as well as invite you, our readers, to ...
Electronic Design
21 小时
Superfan Looks to Breathe New Life into Decades-Old 3dfx Voodoo Video Card
The VoodooX Project is the closest 3dfx fans will get to see a new video card from a company that went under two decades ago.
Electronic Design
22 小时
Ethernet in the Age of AI
You can start with John D'Ambrosia, Chair of the IEEE P802.3dj Task Force and TEF event chair, as he discusses how Ethernet's growth supports the artificial-intelligence (AI) ecosystem. There are more ...
Electronic Design
2 天
Electronics History: AMD’s Unified Shader GPU
The AMD unified shader architecture that debuted in the Xbox 360 ushered in a new era for the graphics processing unit (GPU).
Electronic Design
1 天
The Tech Behind Upskilling the Semiconductor Workforce
CHIPS Act spurred a renaissance moment in the semiconductor industry, threatening to be upended by a significant skills gap.
Electronic Design
2 天
Multiphase Controller Fine-Tunes Power for AI Chips in Data Centers
Inside the latest 16-phase power controller from Alpha and Omega Semiconductor and how it helps feed power-hungry GPUs and ...
Electronic Design
1 天
Arm Releases First Specification for the Chiplet System Architecture
How the newly released standard marks a critical milestone for the technology.
Electronic Design
1 天
Interesting Stuff from CES 2025
Neat tech advances you might have missed at the 2025 Consumer Electronics Show. Developments that were shown behind the scenes at CES.
Electronic Design
8 天
Maximize Flexibility in SoC Design with eFPGAs
An eFPGA is an FPGA that’s embedded into an ASIC to provide one or more programmable-logic fabrics for flexibility and ...
Electronic Design
7 天
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
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