4 天之前 · Deep insights into the increasingly complex task of designing, testing, integrating, and manufacturing semiconductors.

4 天之前 · UCle 2.0 chiplet challenges; more complex chip architectures; verifying custom designs; EDA startup challenges; limits of using AI for data management; livelocks and deadlocks; PCIe over optics; pain points; formal analysis; MCU …

3 天之前 · Product News. Synaptics signed a definitive licensing agreement with Broadcom that includes Wi-Fi 8, ultra-wideband, Wi-Fi 7, advanced Bluetooth, and next-gen GPS/GNSS for the IoT and Android ecosystem, accelerating its edge AI strategy.. Keysight unveiled a design and test solution for LPDDR6 memory in mobile, client computing, and AI applications. The solution includes measurement-based ...

4 天之前 · The migration from monolithic SoCs to chiplet-based designs is creating a confusing array of options and tradeoffs for design teams working at the leading edge, and the number of choices is only going to increase as third-party chiplets begin pouring into the market. That hasn’t dampened the ...

5 天之前 · Cadence’s Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond.. Siemens’ Kyle Fraunfelter and Melville Bryant find that lean approaches alone cannot address the increasingly complex sustainability challenges of semiconductor manufacturing and call for ...

2025年1月23日 · As the universe of applications for power devices grows, designers are finding that no single semiconductor can cover the full range of voltage and current requirements. Instead, combination circuits use different materials for different parts of the overall operating range. GaN is especially well ...

2024年12月13日 · Products and Partnerships. Advantest launched an integrated known-good-die test cell designed to maximize die-level test yields for wide-bandgap devices used in power semiconductors.. Synaptics extended its Veros IoT connectivity family with a dual-core Bluetooth 5.4 and IEEE 802.15.4 system on chip.The Matter-compliant SoC supports Bluetooth Classic, Bluetooth Low Energy, Zigbee, and Thread ...

2025年1月3日 · Global. Micron Technology will invest up to $2.17 billion to expand its DRAM manufacturing operation in Manassas, Virginia.. All new devices sold in the European Union must now support USB-C charging.. UMC received a temporary occupation permit for its Fab 12i Phase 3 expansion in Singapore, a key step in ramping to production. The fab will target 22nm and 28nm chips for 5G, IoT, and ...

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Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful ...